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Interfacial tension的問題，透過圖書和論文來找解法和答案更準確安心。 我們找到下列懶人包和總整理
Interfacial tension的問題，我們搜遍了碩博士論文和台灣出版的書籍，推薦張啟運寫的 （金千）焊手冊（第3版） 和Xu, Jian-Jun的 Interfacial Wave Theory of Pattern Formation in Solidification: Dendrites, Fingers, Cells and Free Boundaries都 可以從中找到所需的評價。
這兩本書分別來自機械工業 和所出版 。
國立臺灣科技大學 機械工程系 曾修暘所指導 黃國禎的 液珠分選系統之初始驗證 （2021），提出Interfacial tension關鍵因素是什麼，來自於液珠微流體、液珠分選、電場。
而第二篇論文國立臺灣科技大學 材料科學與工程系 洪伯達所指導 曾于珊的 利用相分離機制以磷灰石奈米粒子備製新型多孔複合材料 （2021），提出因為有 微/奈米複合材料、界面堵塞乳液凝膠、滲流、堵塞轉變、相分離、氫氧基磷灰石、氨丙基三乙氧基矽烷、表面改質的重點而找出了 Interfacial tension的解答。
（金千）焊手冊（第3版）
為了解決Interfacial tension 的問題，作者張啟運 這樣論述：
是一本應用理論和實際工作經驗總結並重的工具書。全書以被 焊的母材為主線進行敘述：對鋁、銅、鋼、不銹鋼、高溫耐熱合金、難熔金屬、鈦、鋯、鈹、鎂、硬質合金、碳、金剛石、半導體、陶瓷、貴金屬、復合材料、特種材料的 焊，包括部分材料的軟 焊都進行了詳盡的介紹。參加本手冊每一章編寫的作者，都是在該領域中有多年工作經驗和科研成果的專家和技術人員，他們在第2版的基礎上，收集了大量的資料，進行了修訂或重寫，因此本書內容有一定的深度和廣度。書中還加強了應用理論的闡述，特別是在第1章緒論中將界面傳質理論通俗地引入 焊領域，並用以闡明和控制 焊過程，有較新的意義。 Contents第3
版前言Preface of the Third Edition第2版前言Preface of the Second Edition第1版前言Preface of the First Edition第1章 緒論Chapter 1 Introduction11.1 焊方法的原理和特點Principle and Characteristic of Brazing and Soldering Technique11.2熔態 料對固體母材的潤濕和鋪展Wetting and Spreading of Molten Filler Metal on a Solid Base Metal11.2.1固體金屬
的表面結構The Surface Structure of Solid Metal11.2.2熔態 料與固體母材的潤濕Wetting of Molten Filler on Solid Base Metal21.2.3熔態 料在 劑(第二液體)中與母材間界面張力的變化Change of Interfacial Tension between Molten Filler and Base Metal Immersed in a Fused Flux(a second liquid)41.2.4金屬母材表面的氧化膜及其去除機制Oxide Film on Base Metal and its
Removal Mechanism61.2.5熔態 料在固體母材上的鋪展Spreading of Molten Filler Metal on Solid Base Metal71.3熔態 料與固體母材的相互作用Reaction of Molten Filler with Solid Base Metal91.3.1熔態金屬與固體金屬的相互作用Reaction of Molten Metal with Solid Metal91.3.2 料的構成Construction of Filler Metals111.3.3熔態 料在母材間隙中的流動和 縫結構的不均勻性Flowing of
Molten Filler Metal in the Clearance of Base Metals as well as Inhomogeneity of the Formed Fillet141.3.4熔析與熔蝕Liquation and Erosion151.4 縫中熔態 料的凝固和 縫的金相組織Solidification of Molten Filler Metal in Clearance and the Micrographic Structure of the Fillet161.4.1共晶 縫組織The Structure of Eutectic Fillet161
.4.2晶間滲透組織The Fillet Structure with Intercrystalline Penetration161.4.3有化合物生成的 縫組織The Fillet Structure with Intermetallics171.5 劑、 料的選擇與搭配Selection and Matching of Fluxes with Filler Metals181.5.1 劑的選擇Selection of Fluxes181.5.2 料的選擇Selection of Filler Metals201.5.3 劑和 料的搭配Matching of Filler M
etal with Flux211.6 焊工藝Technology of Brazing and Soldering211.6.1接頭的形式與 料在 縫中的流動性Joint Types and Flowability of Molten Filler Metal in the Clearance211.6.2加熱方法Methods for Heating221.6.3工件的升溫速度和冷卻速度Heating and Cooling Rate of Workpieces in Brazing Process231.6.4 焊接頭的保溫處理和結構的彌散Annealing for Brazed
Joints and Structure Dispersion in the Fillet23參考文獻References25第2章 鋁及鋁合金的 焊Chapter 2 Brazing and Soldering of Aluminum and its Alloys272.1概述Introduction272.2鋁及鋁合金的編號Designations of Aluminum and its Alloys272.3鋁及鋁合金的理化性能Physical and Chemical Properties of Aluminum and its Alloys282.3.1鋁及鋁合金的物理性能Phy
sical Properties of Aluminum and its Alloys282.3.2鋁及鋁合金的化學性能Chemical Properties of Aluminum and its Alloys392.4鋁氧化膜的本質及其在加熱時的變化Nature of Oxide Film on Aluminum and its Change during Heating402.5鋁 劑Fluxes for Aluminum Brazing and Soldering412.5.1鋁的硬 劑Fluxes for Aluminum Brazing412.5.2鋁的軟 劑Fluxes f
or Aluminum Soldering532.6 焊時鋁氧化膜的脫除機制Removal Mechanism of Oxide Film on Aluminum during Brazing552.6.1鋁氧化膜與熔鹽 劑的相互作用Interaction of Oxide Film on Aluminum with Molten Salt Flux552.6.2真空環境下金屬蒸氣對鋁氧化膜的破壞Disruption of Oxide Film on Aluminum by Metal Vapor in Vacuum Environment572.7鋁 料Brazing Filler M
etals and Solders for Aluminum Alloys582.7.1Al-Si系 料(液相線溫度范圍570～630°C)Filler Metals of Al-Si Series(melting range 570～630°C)582.7.2Al-Si-Cu-Zn系 料(液相線溫度范圍500～577°C)Filler Metals of Al-Si-Cu-Zn Series(melting range 500～577°C)602.7.3Al-Cu-Ag-Zn系 料(液相線溫度范圍400～500°C)Filler Metals of Al-Cu-Ag-Zn Series
(melting range 400～500°C)612.7.4Al-Ge-Si系 料(液相線溫度范圍425～500°C)Filler Metals of Al-Ge-Si Series (melting range 425～500°C)612.7.5Zn-Al系 料(液相線溫度范圍382～400°C)Solders of Zn-Al Series(melting range 382～400°C)622.7.6Cd-Zn系 料(液相線溫度范圍265～350°C)Solders of Cd-Zn Series(melting range 265～350°C)642.7.7Sn-Zn系 料
(液相線溫度范圍198～260°C)Solders of Sn-Zn Series(melting range 198～260°C)642.7.8Sn-Pb系 料(液相線溫度范圍183～270°C)Solders of Sn-Pb Series(melting range 183～270°C)652.7.9Pb-Bi系 料(液相線溫度范圍124～200°C)Solders of Pb-Bi Series(melting range 124～200°C)662.8鋁的復合 焊材料Composite Fillers for Aluminum Brazing or Soldering662.8
.1鋁 焊板Aluminum Brazing Sheets662.8.2藥芯及藥皮鋁 焊絲Flux Cored and Flux Coated Filler Metals for Aluminum Brazing or Soldering672.8.3 料- 劑粉燒結的復合鋁 焊條(絲)Composites of Sintered Powder Filler Metals with Flux for Aluminum Brazing682.8.4鋁 料膏Aluminum Brazing Paste682.9鋁 焊中的一些特殊技藝Some Special Skills in Alu
minum Brazing and Soldering682.9.1用金屬鎵來作為界面活性劑進行鋁合金零件的精密擴散 焊Gallium Used as a Surfactant for Precise Soldering of Aluminum Alloy Parts682.9.2用鍺粉進行鋁合金的無 劑擴散 焊Fluxless Diffusion Brazing of Aluminum Alloys with Germanium Powders692.9.3鋁及鋁合金的表面軟 焊 塗改性Surface Modification of Aluminum Alloys by Solde
r-coating692.9.4鋁的自 軟 劑Self-soldering Flux Used for Soldering Aluminum Alloy Parts692.9.5鋁合金面上敷以Nocolok 劑- 粉-合成樹脂復合塗層A Composite Coating on Aluminum Alloys Made by Resinized Silicon and Nocolok Flux702.10鋁 焊的焊前准備和焊後處理Pre-brazing Preparations and Post-brazing Operations702.10.1接頭和夾具的設計Joint and
Jig Design702.10.2工件的預清洗Pre-cleaning of Workpieces to be Brazed722.10.3工件焊後的清洗Post-braze Cleaning of Workpieces742.10.4鍍覆Finishing75參考文獻References76第3章 銅和銅合金的 焊Chapter 3 Brazing and Soldering of Copper and Copper Alloys803.1概述Introduction803.2 焊性Brazability and Solderability843.2.1純銅Copper843.2.2普
通黃銅Brasses843.2.3錫黃銅Tin Brasses843.2.4鉛黃銅Leaded Brasses843.2.5錳黃銅Manganese Brasses843.2.6錫青銅Tin Bronzes843.2.7鋁青銅Aluminum Bronzes843.2.8鈹銅Beryllium Copper853.2.9 青銅Silicon Bronzes853.2.10鉻銅和鎘銅Chromium Copper and Cadmium Copper853.2.11白銅合金Copper-nickel Alloys853.3 焊接頭間隙Clearance of Brazed Joint853.
4軟 料Solders883.4.1鎵基 料Gallium Based Solders883.4.2鉍基 料Bismuth Based Solders893.4.3銦基 料Indium Based Solders893.4.4錫鉛 料Tin Lead Solders893.4.5無鉛 料Lead Free Solders943.4.6高溫錫 料High Temperature Tin Solders1063.4.7鉛基 料Lead Based Solders1073.4.8鎘基 料Cadmium Based Solders1073.4.9金基軟 料Gold Based So
lders1083.5硬 料Brazing Filler Metals1083.5.1對 料的基本要求Demands on Brazing Filler Metals1083.5.2 料的分類Classification of Brazing Filler Metals1083.5.3 料的型號與牌號Designations of Brazing Filler Metals1083.5.4銀 料Silver Filler Metals1093.5.5低銀 料Low Silver Based Filler Metals1233.5.6銅磷 料Copper-phosphorus Fi
ller Metals1303.6 劑Fluxes1353.6.1 劑的功能Functions of Brazing Fluxes1353.6.2對 劑的基本要求Demands on Brazing Fluxes1353.6.3 劑的分類及型號Classification and Type of Fluxes1363.7軟 劑Soldering Fluxes1363.7.1腐蝕性 劑Corrosive Fluxes1373.7.2弱腐蝕性 劑Medial Corrosive Fluxes1383.7.3無腐蝕性 劑Non-corrosive Fluxes1393.8硬 劑Br
azing Fluxes1403.9表面准備Surface Preparation1433.10接頭設計Joint Design1433.11 焊方法和工藝Methods and Technology of Soldering and Brazing1443.11.1銅Copper1443.11.2黃銅Brasses1443.11.3銅和黃銅軟 焊接頭強度The Strength of Copper and Brass Soldered Joints1443.11.4錳黃銅Manganese Brasses1473.11.5鈹銅Beryllium Copper1483.11.6鉻銅Chro
mium Copper1483.11.7鎘銅和錫青銅Cadmium Copper and Tin Bronzes1483.11.8 青銅Silicon Bronzes1483.11.9鋁青銅Aluminum Bronzes1483.11.10鋅白銅和錳白銅Copper-nickel Alloys149參考文獻References149第4章 電子工業中的軟 焊Chapter 4 Soldering in Electronic Industry1514.1電子制造與軟 焊Electronic Manufacture and Soldering1514.1.1軟 焊在電子工業中的地位The
Position of Soldering Technique in Electronic Industry1514.1.2電子制造與電子封裝Electronic Manufacture and Electronic Packaging1514.1.3電子工業中 焊連接的特點及發展歷程The Characteristic and Development Course of Soldering Technique in Electronic Industry1524.2軟 焊連接的基本原理Fundamental of Soldering1544.2.1軟 焊的定義Definition o
f Soldering1544.2.2 料與母材間的相互作用Interaction Between Solder and Base
液珠分選系統之初始驗證
為了解決Interfacial tension 的問題，作者黃國禎 這樣論述：
本研究作為主動式微流液珠分選技術(Droplet sorting microfluidics)之優化與延伸，以簡單的電控系統搭配高度靈活性的電極設計，解決此領域的兩大難題：(1)液珠分選的通量極限、(2)複雜的電控系統控制。此研究展示高通量的液珠分選系統，具備三通道、易製作、低成本、非直接接觸電極之優點，展現應用於微流體領域的高度實用性，特別是螢光激發液珠分選系統(Fluorescence active droplet sorter, FADS)及微全分析系統(Micro total analysis system, μTAS)。利用聚焦型流道(Flow-focusing injection
)將水珠形成在油中稱為液珠，接著高壓電源供應器施加靜電場於由液態金屬所製作的非接觸式立體電極，液珠在生成時受到電場的影響下產生偏移並流入分選流道中完成分選機制，可有效提升通量限制且避免過於複雜的電極設計與電控系統。實驗數據的測定使用高速攝影機實現對液珠分選機制的影像分析，利用影像處理逐幀分析驗證分選機制並找出不同參數下的液珠生成與電場之間的關係，參數包含液珠通量、大小、型態、軌跡及電場強度。最後，在每秒生成3800顆液珠下實現分選，驗證系統之實用性。
Interfacial Wave Theory of Pattern Formation in Solidification: Dendrites, Fingers, Cells and Free Boundaries
為了解決Interfacial tension 的問題，作者Xu, Jian-Jun 這樣論述：
For the last several years, the study of interfacial instability and pattern formation phenomena has preoccupied many researchers in the broad area of nonlinear science. These phenomena occur in a variety of dynamical sys- tems far from equilibrium. In many practically very important physical sys- t
ems some fascinating patterns are always displayed at the interface between solid and liquid or between two liquids. Two prototypes of these phenomena are dendrite growth in solidification and viscous fingering in a Hele-Shaw cell. These two phenomena occur in completely different scientific fields,
but both are described by similar nonlinear free boundary problems of partial- differential-equation systems; the boundary conditions on the interface for both cases contain a curvature operator involving the surface tension, which is nonlinear. Moreover, both cases raise the same challenging theor
etical is- sues, interfacial instability mechanisms and pattern selection, and it is now found that these issues can be solved by the same analytical approach. Thus, these two phenomena are regarded as special examples of a class of nonlinear pattern formation phenomena in nature, and they are the p
rominent topics of the new interdisciplinary field of nonlinear science. This research monograph is based on a series of lectures I have given at McGill University, Canada (1993-1994), Northwestern Poly technical In- stitute, China (1994), Aachen University, Germany (1994), and the CRM summer school
at Banff, Alberta, Canada (1995). Dr Jian-Jun Xu is a professor in the Department of Mathematics and Statistics at McGill University, Canada. He is an outstanding applied mathematician, working in the interdisciplinary area of applied mathematics, condensed matter physics, material science and fl
uid dynamics. He has published four monographs and about one hundred research papers. His expertise includes but is not limited to: asymptotics and numerical analysis, dynamical systems of non-Linear PDE with particular emphasis in the areas of solidification physics, interfacial wave theory, patter
n formation and crystal growth.
利用相分離機制以磷灰石奈米粒子備製新型多孔複合材料
為了解決Interfacial tension 的問題，作者曾于珊 這樣論述：
本研究嘗試由水/2,6-二甲基吡啶相分離系統組成之雙連續界面堵塞乳液凝膠( Bicontinuous Interfacially Jammed Emulsion Gels, Bijel )，結合化學改性的羥基磷灰石(HAp)奈米粒子網目製造一新型雙連續滲流軟材料。首先為了拓展奈米粒子的功能性，特別用氨丙基三乙氧基矽烷（APTS）修飾表面以得疏水HAp-APTS。這種化學修飾可做為染料連接劑，也能進一步被其他生物活性分子功能化。在控制溫度的情况下，觀察到隨相分離後界面出現，粒子聚集、形成網目能有效減緩兩相成長粗化。接著為了進一步了解粒子網目形成時「相分離動力學」與「相疇幾何」的複雜互動，紀錄該
Bijel系統在不同粒子參數(粒徑和濃度)下隨時間的相疇尺寸演變。最後藉由聚乙二醇二丙烯酸酯(PEGDA)的選擇性光固化，強化由HAp-APTS 網目形成的微米尺度Bijel 模板。即能在維持結構型態的前提下，為後續不同應用領域精準設計高比表面積且相疇尺寸可控制的多孔結構。