HP Z1的問題,透過圖書和論文來找解法和答案更準確安心。 我們找到下列懶人包和總整理

另外網站HP Z1 Workstation也說明:NOTE 2: HP Linux Installer Kit Includes drivers for 32-bit and 64-bit OS versions of Red Hat. Enterprise Linux (RHEL) 5 Workstation, RHEL 6 ...

長庚大學 奈米工程及設計碩士學位學程 周煌程、杨杰圣所指導 梁文顏的 低功耗高性能電流式感測放大器設計 (2020),提出HP Z1關鍵因素是什麼,來自於電流式電路、感測放大器。

而第二篇論文明志科技大學 電子工程系碩士班 陳華彬所指導 賴威翰的 電壓模式二階濾波器與正交振盪器之 實現與應用 (2018),提出因為有 電壓模式濾波器、正交振盪器、差動差分電流傳輸轉導運算放大器、積體電路的重點而找出了 HP Z1的解答。

最後網站HP Z1 Workstation AIO has a 27-inch flip-up screen, lets you ...則補充:HP's new Z1 all-in-one workstation has desktop-grade silicon, and an easy-to-access chassis. The Z1's 27-inch IPS 2560 x 1440 display snaps ...

接下來讓我們看這些論文和書籍都說些什麼吧:

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低功耗高性能電流式感測放大器設計

為了解決HP Z1的問題,作者梁文顏 這樣論述:

Table of ContentsRecommendation Letters from Thesis AdvisorsThesis/Dissertation Oral Defense Committee CertificationPreface iiiAbstract ivTable of Contents vList of Figures viiList of Tables xiChapter 1 Introduction 11.1 Memory and Processors 21.2 Sense Amplifiers 31.3 Technology Trends 41.4 Circui

t Trends 51.5 Other Trends 61.6 SRAM Trends 71.7 Associated Challenges 9Chapter 2 A Circuits Survey 102.1 The Two Broad Classes 102.2 Voltage Sensing 122.3 Current Sensing 162.4 Others 20Chapter 3 Development of a Three-Transistor I–V Converter 223.1 Low Drop-Out Voltage Regulator as a I–V Converter

233.2 I–V Converter as a Current Sense Amplifier 253.3 Simplifying the I–V Converter 253.4 Proof of Concept 273.5 Quest for a Better Error Amplifier 293.6 Revisiting the Proof of Concept 31Chapter 4 Implementation of a Current Sense Amplifier 344.1 Sense Amplifier Shut-Down 344.2 Static Power Reduc

tion 364.3 Pulsed Word-Line Operation 374.4 Bit-Line Capacitance—Effect on Delay 394.5 Bias Variation 414.6 Relevant Concerns 43Chapter 5 Conclusion 445.1 Simulation Results 445.2 Considerations for Long Bit-Lines 465.3 Measurements 475.4 Derivative Circuits 495.5 Derivative Use 525.6 Summary 555.7

Final Thoughts 55References 56Appendices 83List of FiguresFigure 1.1 Die micrograph from [Singh et al., 2018] 2Figure 1.2 Layout from [Takemoto et al., 2020] 2Figure 1.3 Package from [Poulton et al., 2019] 4Figure 1.4 Wearable for happiness index from [Yano et al., 2015] 6Figure 1.5 Test chip from [

Song et al., 2017] 7Figure 2.1 Left–right: nMOS common-source, -gate and -drain amplifier configurations 10Figure 2.2 Left–right: pMOS common-drain, -gate and -source amplifier configurations 11Figure 2.3 Bi-stable constructed of two inverters 11Figure 2.4 Regenerative latch transient simulation out

put 11Figure 2.5 nMOS differential pair 12Figure 2.6 nMOS–input pair differential amplifier 13Figure 2.7 Clocked latch with isolation 14Figure 2.8 Current-controlled latch 15Figure 2.9 Left–right: Resistor and nMOS approximates 16Figure 2.10 Left–right: Resistor and pMOS approximates 16Figure 2.11 n

-p-n common-base amplifier 17Figure 2.12 Partial schematic from [Yeo and Rofail, 1995] 17Figure 2.13 Left–right: nMOS and pMOS current mirrors 18Figure 2.14 Current sense amplifier from [Ishibashi et al., 1995] 18Figure 2.15 Current sense amplifier from [Seno et al., 1993] 19Figure 2.16 Current conv

eyor from [Seevinck et al., 1991] 19Figure 2.17 pMOS-neutralised nMOS differential pair 20Figure 2.18 Λ-type negative resistance from [Wu and Lai, 1979] 21Figure 2.19 I D -V D characteristic of the Λ-type negative resistance 21Figure 3.1 Three-transistor I–V converter 22Figure 3.2 Simplified low dro

p-out voltage regulator 23Figure 3.3 Low drop-out voltage regulator configured as a I–V converter 24Figure 3.4 Low drop-out voltage regulator as a current sense amplifier 25Figure 3.5 Reference-free I–V converter 26Figure 3.6 Logic inverters as positive-gain amplifier 26Figure 3.7 Proof of concept d

esign 27Figure 3.8 Proof of concept design transient simulation output 28Figure 3.9 Typical and unintended input(s) of the logic inverter 29Figure 3.10 Normalised absolute gain plot for each inverter input 30Figure 3.11 Connections made for the absolute gain plot 30Figure 3.12 Bias generator for the

absolute gain plot 31Figure 3.13 Error amplifier replacement in the proof of concept design 31Figure 3.14 Three-transistor I–V converter 32Figure 3.15 Corresponding bias generator of Figure 3.14 32Figure 3.16 Simulation circuit for verifying the improved error amplifier 33Figure 3.17 Demonstration

of the three-transistor I–V converter as a current sense amplifier 33Figure 4.1 Actions to achieve desired node characteristics during shut-down 34Figure 4.2 Figure 3.14 modified for shut-down 35Figure 4.3 Corresponding bias generator of Figure 4.2 35Figure 4.4 Shared use of bias generator 36Figure

4.5 Pseudo-differential version of Figure 4.4 37Figure 4.6 Pseudo-differential configuration of Figure 3.14 37Figure 4.7 Pulsed read of a ZERO 38Figure 4.8 Pulsed read of a ONE 38Figure 4.9 Differential development across dynamic bit-lines and csa outputs 39Figure 4.10 Delay behaviour with capacitiv

e bit-line loading 40Figure 4.11 Normalised csa bias current variation with supply voltage 41Figure 4.12 Normalised csa bias current variation with temperature 42Figure 4.13 Mismatch view of Figure 3.14 43Figure 5.1 Test set-up (external trigger connection not drawn) 47Figure 5.2 Oscillogram demonst

rating circuit functionality at VDD = 2.55V 47Figure 5.3 Test set-up photograph 48Figure 5.4 Left–right: Three-transistor I–V converter and its complement 49Figure 5.5 Transfer characteristics of the circuits in Figure 5.4 49Figure 5.6 Four-transistor I–V converter 50Figure 5.7 Corresponding bias ge

nerator of Figure 5.6 50Figure 5.8 Impact of sizing on AC performance 51Figure 5.9 Left–right: V SS -, V DD -referenced and floating optical receiver front ends 52Figure 5.10 Transfer characteristic of floating I–V converter 53Figure 5.11 High output resistance eases filter realisation 53Figure 5.12

Three-transistor I–V converter operating as an open-drain receiver 54Figure A.1 inv symbol 84Figure A.2 Alternate inv symbol 84Figure A.3 inv transistor-level schematic 84Figure A.4 inv4 symbol 85Figure A.5 inv4 transistor-level schematic 85Figure A.6 inv16 symbol 86Figure A.7 inv16 transistor-leve

l schematic 86Figure A.8 nand2 symbol 87Figure A.9 nand2 transistor-level schematic 87Figure A.10 nand2b symbol 88Figure A.11 nand2b gate-level schematic 88Figure A.12 nor2 symbol 89Figure A.13 nor2 transistor-level schematic 89Figure A.14 nor2b symbol 90Figure A.15 nor2b gate-level schematic 90Figu

re A.16 or2 symbol 91Figure A.17 or2 gate-level schematic 91Figure A.18 tinv symbol 92Figure A.19 tinv transistor-level schematic 92Figure A.20 dlat symbol 93Figure A.21 dlat gate-level schematic 93Figure A.22 dlatr symbol 94Figure A.23 dlatr gate-level schematic 94Figure A.24 dlats symbol 95Figure

A.25 dlats gate-level schematic 95Figure A.26 tie0 symbol 96Figure A.27 tie0 transistor-level schematic 96Figure A.28 tie1 symbol 97Figure A.29 tie1 transistor-level schematic 97Figure B.1 bit0 symbol 99Figure B.2 bit0 transistor-level schematic 99Figure B.3 bit1 symbol 100Figure B.4 bit1 transistor

-level schematic 100Figure B.5 blrc symbol 101Figure B.6 blrc cell-level schematic 101Figure B.7 pre symbol 102Figure B.8 pre transistor-level schematic 102Figure B.9 rblrc symbol 103Figure B.10 rblrc cell-level schematic 103Figure B.11 wr symbol 104Figure B.12 wr transistor-level schematic 105Figur

e B.13 anand2 symbol 106Figure B.14 Alternate anand2 symbol 106Figure B.15 anand2 transistor-level schematic 107Figure B.16 ckgen symbol 108Figure B.17 ckgen gate-level schematic 108Figure B.18 peri symbol 109Figure B.19 peri cell-level schematic 110Figure B.20 csa symbol 111Figure B.21 csa transist

or-level schematic 111Figure B.22 kobl symbol 112Figure B.23 Alternate kobl symbol 112Figure B.24 kobl transistor-level schematic 113Figure B.25 kobs symbol 114Figure B.26 kobs transistor-level schematic 114Figure C.1 sram1 symbol 116Figure C.2 sram1 block-level schematic 117Figure C.3 sram2 symbol

118Figure C.4 sram2 block-level schematic 119Figure C.5 sram3 symbol 120Figure C.6 sram3 block-level schematic 121Figure D.1 ainvl symbol 123Figure D.2 ainvl transistor-level schematic 123Figure D.3 ainvs symbol 124Figure D.4 Alternate ainvs symbol 124Figure D.5 ainvs transistor-level schematic 124F

igure D.6 cut symbol 125Figure D.7 cut cell-level schematic 126Figure D.8 inAmp symbol 127Figure D.9 inAmp cell-level schematic 127Figure D.10 CD4007 symbol 128Figure D.11 CD4007 transistor-level schematic 128Figure D.12 LF356 symbol 129Figure D.13 LF356 cell-level schematic 129Figure D.14 TL431 sym

bol 130Figure D.15 TL431 cell-level schematic 130Figure D.16 tialp symbol 131Figure D.17 tialp transistor-level schematic 131Figure D.18 tiasd symbol 132Figure D.19 tiasd transistor-level schematic 132Figure D.20 tiasn symbol 133Figure D.21 tiasn transistor-level schematic 133Figure D.22 tiasp symbo

l 134Figure D.23 tiasp transistor-level schematic 134Figure E.1 nfet and equivalent nMOS symbol 135Figure E.2 pfet and equivalent pMOS symbol 136Figure E.3 Circuit for estimating per-bit junction capacitance 137Figure E.4 Simulation output for estimating per-bit junction capacitance 138Figure E.5 Ci

rcuit for estimating per-bit bit-line leakage current 138Figure E.6 ID-VD characteristics 139Figure E.7 ID-VG characteristics 140Figure E.8 anand2 transistor-level schematic 141Figure E.9 Test board functional blocks 144Figure E.10 Test board block-level schematic 145Figure E.11 Signal source connec

ted to abbreviated input network 148Figure E.12 General form of a typical instrumentation amplifier 150Figure E.13 Inverting integrator section of test board 154List of TablesTable 1.1 Semiconductor memory hierarchy 1Table 5.1 Column height h = 512b 44Table 5.2 Column height h = 1Kb 44Table 5.3 Colu

mn height h = 2Kb 44Table 5.4 Summarised measurement results 48Table A.1 List of standard cells 83Table A.2 inv truth table 84Table A.3 inv4 truth table 85Table A.4 inv16 truth table 86Table A.5 nand2 truth table 87Table A.6 nand2b truth table 88Table A.7 nor2 truth table 89Table A.8 nor2b truth tab

le 90Table A.9 or2 truth table 91Table A.10 tinv truth table 92Table A.11 dlat truth table 93Table A.12 dlatr truth table 94Table A.13 dlats truth table 95Table A.14 tie0 truth table 96Table A.15 tie1 truth table 97Table B.1 List of custom cells 98Table B.2 pre truth table 102Table B.3 wr truth tabl

e 104Table C.1 SRAM cells and read path configurations 115Table D.1 List of other cells 122Table E.1 Transistor performance 140Table E.2 Primary bill of materials 146Table E.3 Additional hardware 147Table E.4 List of instruments 155Table F.1 List of abbreviations 158Table F.2 List of symbols 159Tabl

e F.3 List of AC quantities 160Table F.4 List of DC quantities 161Table F.5 List of partial-swing signals 162Table F.6 List of rail–rail signals 162Table F.7 List of instance names 163

電壓模式二階濾波器與正交振盪器之 實現與應用

為了解決HP Z1的問題,作者賴威翰 這樣論述:

本論文基於差動差分電流傳輸轉導運算放大器(Differential Difference Current Conveyor Transconductance Amplifiers, DDCCTAs)提出了三種電壓模式二階濾波器電路和一種電壓模式正交振盪器電路。第一個提出的電路使用兩個差動差分電流傳輸轉導運算放大器DDCCTA,兩個接地電容器和兩個接地電阻器。使用接地的電容器使得所提出的電路有利於積體電路(Integrated Circuit, IC)的實現。本電路可同時提供低通(Low-pass, LP),帶通(Band-pass, BP),高通(High-pass, HP)和帶拒(Band

-reject, BR)濾波響應,同時經由增加一個輸入電壓訊號時,可以容易的獲得全通(All-pass, AP)濾波響應。本電路具有高輸入阻抗端,並提供品質因數(Quality factor, Q)和諧振角頻率(resonance angular frequency, ωo)的正交可調整性。此外,經由修改第一個提出的電壓模式二階濾波器,一種可以獨立控制振盪條件和振盪頻率的正交弦波振盪器被第二個提出。第二個提出的振盪器電路,具有兩個正交的電壓輸出端與一個具高輸出阻抗端振幅可調整的輸出電流端。當第一DDCCTA的輸入偏壓電流用作調變訊號時,本電路可提供振幅調變(Amplitude Modulati

on, AM)或幅移鍵控(Amplitude-shift keying, ASK)訊號。AM或ASK訊號可廣泛用於通信系統。第三個提出的電路使用兩個DDCCTA,兩個接地電容器和三個接地電阻器。所提出的電路可同時提供電壓模式LP,BP,HP,BR和AP濾波響應並具有高輸入阻抗端,有利於輸入訊號的串接。本電路不需要任何的元件匹配條件,並且電路的Q和ωo可以正交調整。第四個提出的電路,使用單一DDCCTA,結合兩個接地電容器和三個電阻器,在相同的電路結構下,可同時實現LP,BP,HP,BR和AP濾波響應。本電路的Q和ωo可以正交調整。最後,本論文使用Hspice與Spectre對所有提出的電路進行

模擬,以驗證電路的可行性。