C4 bump的問題，透過圖書和論文來找解法和答案更準確安心。 我們找到下列懶人包和總整理

C4 bump進入發燒排行的影片

應用於異質整合平台與下世代微機電系統之先進封裝關鍵技術開發

為了解決C4 bump的問題，作者蔡逸杰 這樣論述：

Table of Contents摘 要 iAbstract iv誌 謝 viiiTable Captions xiiiFigure Captions xivChapter 1 Introduction 11.1 General Background 11.2 Heterogeneous integration platform and MEMS encapsulation 31.3 Organization of the thesis 5Chapter 2 Low Thermal Budget Chi

p-level Stacking by Metal Bonding 92.1 Introduction 92.2 Electroless nickel immersion gold (ENIG) to Sn-Cu microbump bonding 112.2.1 Specification of bonding structure and process flow 112.2.2 Bonding mechanism of ENIG-Sn/Cu joint 122.2.3 Bonding joint analyses 132.2

.4 Electrical measurement and reliability test 132.3 Cu pillar to In-Sn-Cu pad bonding with Ni buffer layer 142.3.1 Specification of bonding structure and process flow 142.3.2 Mechanism of Cu pillar to In-Sn-Cu pad bonding with Ni buffer layer …………………………………………………………………………….15

2.3.3 Bonding joint analyses 162.3.4 Electrical measurement and reliability test 172.4 Cu pillar to Cu pillar direct bonding with Pd passivation layer 172.4.1 Specification of bonding structure and process flow 172.4.2 Mechanism of Cu pillar to Cu pillar direct bonding wit

h Pd passivation layer 192.4.3 Bonding joint analyses 202.4.4 Electrical measurement and reliability test 212.5 Demonstration of 2.5D heterogeneous integration with chip-level bumping process 222.5.1 2.5D integration platform scheme 222.5.2 Electrical Property and Relia

bility Test of the 2.5D Platform 232.6 Summary 24Chapter 3 Wafer-on-wafer (WOW) Bumpless TSV Structure for DRAM Application 423.1 Introduction 423.2 Specifications and process flow 443.3 Electrical measurement and reliability test 453.4 New lumped circuit model an

d high frequency simulation 493.5 Summary 52Chapter 4 Highly Productive and Reliable Wafer-level MEMS Packaging …………………………………………………………………….684.1 Introduction 684.2 Au-Sn eutectic bonding v.s. Au-Au direct bonding 704.3 Ultra-thin glass-based wafer-level stacking through

metal bonding 714.4 Stability investigation of metal combination 724.5 Summary 75Chapter 5 Conclusion and Future Work 925.1 Conclusion 925.2 Future Work 94Reference …………………………………………………………………….96簡歷(Vita) …………………………………………………………………...105